Volume 2 Number 4 / Editor: Steve Scheinpflug / December 1998 |
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New Product (Post Lamination Drilling) Tech Talk Annual Toy Drive Shots From The Shop Upcoming Show Happy Anniversary A Winning Season Website Tour Expressing Your Interest
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New Product Release
ultiline Technology is pleased to announce the addition of the latest member to our registration tooling systems family. The New XRT-1000 which is an X-ray tooling and Inspection system designed for Post Lamination Drilling of Multilayers.
Layer to layer registration variation from panel to panel can occur during lamination of
multilayer panels. Post processing these panels in preparation for drilling demands the use of X-Ray to locate internal copper images and then drill of new tooling holes for pinning to the Drill.
The XRT 1000 X-rays every panel and drills new tooling holes based on the panels
individual registration characteristics. Any registration errors caused by material
instability, or shifts during the lamination cycle are compensated by optimizing the
location of the drilled tooling holes to the stack up of internal targets on every individual layer. The result of this process is better registration drilled of drilled holes to internal pads registration through the panel, no program drill offsets, faster set-up on the Drill, and increased thru puts in the Drill Room, Drill down time for offset determination is virtually eliminated.
The XRT is loaded manually by the operator, thru puts of over 200 panels per hour can be expected but may vary depending on the operators efficiency. The operation of the XRT is user friendly with easy to read screens. The software prompts the operator on the monitor with all the necessary instructions for operating the system.
The Main Features include:
Lap Software (Layer Analysis Package) Although the XRT functions by looking at a stack up of targets with X-Ray, and determines a best fit before drilling, it also has the ability to analyze movement on a layer by layer basis. Unlike other measuring techniques currently available for layer analysis of laminated panels, X-Ray is non-destructive and can be performed during the normal progression of the panel through the process steps. In some of the other methods of internal layer analysis the panel must be drilled before it can be checked. This not only requires another step but also adds the drill tolerance to the measuring accuracy. The XRT with the LAP (Layer Analysis Package) has the capability to calculate spreads (material growth or shrinkage) for both X and Y axis for each individual layer in a laminated multilayer printed circuit board. In addition to common targets used for drilling, a set of targets specific to each layer is imaged and etched on the innerlayers. To use LAP, the operator places the panel in the machine and selects the TEST MODE. The panel is aligned and nulled to the common target stack. The operator can select which layers to have the machine measure. Up to nine targets can be selected. If targets are placed on the X and Y-axis then the panel can be rotated and placed back in the machine. The X-Ray cameras automatically move to the "Y" dimension and the machine automatically goes thru the same routine as was performed in the "X" axis Home | About Us | Staff | Directions | Products | News | Trade Shows | Literature | Employment | Contact Us
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