Layer Analysis Package (LAP)

lthough the Optiline PL functions by looking at a stack up of targets with X-Ray, and determines a best fit before drilling, it also has the ability to analyze movement on a layer-by-layer basis. This provides SPC data which enables the multilayer manufacturer to scale the artwork on actual results of lamination.

Unlike other measuring techniques currently available for layer analysis of laminated panels, X-Ray is non-destructive and can be performed during the normal progression of the panel through the process steps. In some of the other methods of intemal layer analysis the panel must be drilled before it can be checked. Not only does this require another step but adds the drill tolerance to the measuring accuracy.

The Optiline PL with the layer analysis package has the capability to calculate spreads (material growth or shrinkage) for both "X" and "Y" axis for each individual layer in a laminated multilayer printed circuit board. In addition to the common targets used for drilling, a set of targets specific to every layer is imaged and etched on the innerlayers. To use the LAP, the operator places the panel in the machine and selects TEST MODE. The panel is aligned and nulled to the common target stack. The operator can then select which layers to have the machine measure. Up to nine target pairs can be selected. If targets are placed on both the "X" and "Y" axis then the panel can be rotated and placed back in the machine. The x-ray cameras automatically move to the "Y" dimension and the machine automatically goes through the same routine as was performed in the "X" axis.

In only a few minutes information is obtained on the actual growth or shrinkage of each innerlayer. The data is collected for all the layers measured and a printout is provided which includes the following statistical data:
1. Calculated spreads for each layer measured
2. Minimum and maximum spread
3. Average spread
4. Standard deviation

Home | About Us | Staff | Directions | Products | News | Trade Shows | Literature | Employment | Contact Us

© 1997 Multiline Technology