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Volume 3 Number 1 / Editor: Steve Scheinpflug / March 1999 |
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  Multiline's Products at IPC 1999 Tech Talk Year 2000 Revisited Free Tefstop Samples Happy Anniversary Expressing Your Interest
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 ultiline Technology is pleased to announce that we will be attending the IPC Printed Circuits Exposition which is scheduled for March 16-18,1999 at the Long Beach Convention Center in Long Beach, California. The IPC Printed Circuits Exposition is one of the largest exibitions in North America focused exclusively on the Printed Wiring Board industry. We will be located at Booth #1555.This year’s show is a great time for everyone who has an interest in the latest technology of Registration Tooling Systems for tomorrow’s demanding business needs. Multiline’s registration systems take the guesswork out of perfect registration. Our systems will satisfy all your needs ranging from Artwork, Innerlayers, Outerlayers and Soldermask generation. Many customers are not aware that we also have developed a complete line of lamination accessories. These accessories have been developed with years of experience in the PWB Industry. Being a leader in the PWB Industry many of our customers are not aware that Multiline is a full machine shop and not just an assembly plant. We have an engineering design staff of nearly thirty people who design our dependable, heavy-duty equipment. Multiline has extensive machining and manufacturing facilities. These range from the classic machining and boring units that can hold tolerances of 0.0002” over 40 inches! Our facilities also include complete heat treating facilities, surface grinding, conventional and wire EDM (electrical discharge machining). All our punches, dies and lamination plate bushings are fabricated from raw stock in-house, to maintain complete quality control to achieve the utmost in accuracy. If fact, all critical processes are done in-house. The only things we don’t do are sheet metal, painting and welding. During the past couple of years Multiline Technology has developed many new innovative products and technologies which fit every company’s need and budget. With this new technology readily available you owe it to yourself to explore what we can do for you. The Optiline PE/ATP is an advanced automated system for precise post-etch punching of innerlayers. The main elements of the ATP Series are a panel feed system, a video control package, and a punch and die system engineered to repeatably pierce an accurate registration-tooling pattern. Multiline Technology offers three models from which to choose; the ATP 1000, 3000 and 5000. The ATP 1000, 3000 and 5000 all offer thin material capability down to 2 mil core at speeds for most innerlayers exceeding 7+ panels per minute. The ATP 1000 and 3000 are both manually loaded and the panel roughly located by the operator on a pre-positioning table at the front of the machine. The ATP 5000 is a completely automatic machine, which requires no operator to run panel lots and can be incorporated with material loaders and stackers. Multiline’s New Stacker Interleaver is also an available option for all the ATP’s. The XRT 1000 is an X-Ray Tooling and Inspection System designed for Post Lamination Drilling of multilayers. Layer to layer registration variation from panel to panel can occur during multilayer lamination. Post processing these panels in preparation for drilling demands the use of x-ray to locate internal copper images and then drill new tooling holes for pinning to the drill machine. The XRT x-rays every panel and drills new tooling holes based on the panels individual registration characteristics. Any registration errors caused by material instability or shifts during lamination cycles are compensated by optimizing the location of the drilled holes to the stack up of internal targets on every individual layer. The XRT is manually loaded by the operator and thruputs of over 200 panels per hour can be expected but may vary depending on the operators efficiency. Multiline’s New Stacker/Interleaver is a revolutionary new product for tomorrow’s business needs. This new stacker has made a big impression on our customers not only because of it’s low price but because of its small dimensions. This unit attaches to the back of our OPE/ATP and is designed to match the specifications of the ATP in its capability to handle thin cores at high thruput. This unit alternates between placing innerlayers and slip sheets into a removable tote. The panel is delivered to the unit from the conveyor outfeed section of the OPE/ATP. The slip sheet material is stacked on an automatically adjusting elevator table and is picked up by a linear motor and suction cups and placed in the tote, over the innerlayer. This unit is interfaced to the OPE/ATP but can be used with other equipment requiring interleaving.
The Multiframe is a complete drawer replacement frame with interchangeable glass that easily adapts to existing exposure units. This unit can be utilized for imaging innerlayers and outerlayers as well as soldermask. See for yourself why the Multiframe is the most popular glass exposure frame on the market! Home | About Us | Staff | Directions | Products | News | Trade Shows | Literature | Employment | Contact Us
© 2002 Multiline Technology
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