Volume 2 Number 2 / Editor: Steve Scheinpflug / June 1998



SPC Data
What's It All About?

Tech Talk
IPC '98
Lamination Help
Happy Aniversary
Expressing Your Interest

Vice President's Message

n April, Multiline Technology exhibited equipment at the 1998 IPC Printed Circuits Expo which was held this year at the Long Beach Convention Center in Long Beach, California.

This year’s show was a great success. The show affords us an excellent opportunity to display our products and to meet with most of our existing customers and make contacts with new potential customers.

Typically, we introduce new products at the show and this year was no exception. The Multiframe generated much interest, so much so that orders were placed during the show itself. The Multiframe is a glass phototool for aligning artwork which are retrofit into exposure machines. The unit was designed to give the most precise front to back registration for double sided PCB’s and Multilayers providing long term repeatability and accuracy.

The Optiline PE (Post Etch) ATP 5000 was once again a show stopper. Large crowds of people always seemed to congregate around the machine. It has the capability of processing inner layers as thin as .002 “ (0.05mm) at rates exceeding seven panels a minute.

Multiline has become one of the largest exhibitors at the IPC. This year’s booth was expanded to fifteen hundred square feet in order to accommodate the Cedal products along with the Multiline equipment. In addition to the Adara Press (Continuous Foil Lamination), Cedal also introduced a registration bonding machine for Multilayers. It uses a template which registers the layers in precise alignment on pins and bonds the layers utilizing six welding heads.

Multiline’s new booth was expanded to accommodate more registration tooling equipment, and included two conference rooms, where several orders were negotiated. The columns, truss and overhead sign make Multiline Technology recognizable from just about anywhere in the exhibit hall. Our next exhibit will be held at the European PCB Convention in Wiesbaden, Germany September 29 to October 1, 1998. We look forward to meeting with many of our overseas customers at the Multiline International Europa booth.

Sincerely,

David Angelo
Vice President

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